Master Thesis Application of Clifford Algebra - Wafer Grinding Process to Simplification of Modeling & Simulation Process

Wafer Grinding is an essential part of micro sensor production process. The primary motivation for modeling and simulating the Waver grinding process is to achieve a deeper scientific understanding and enhanced control over a highly complex and critical manufacturing step. By developing a predictive virtual model, we can move from an empirical, trial-and-error approach to a more efficient, science-based methodology.

• During your thesis, you will develop and implement novel simulation frameworks to tackle complex, real-world engineering challenges.
• Furthermore, you will combine Clifford algebra with the grinding process to generate model equations with a simple structure and direct applicability.
• You will optimize key process parameters such as grinding wheel specifications, feed rate, and depth of cut in a cost-effective virtual environment.
• In Addition, you will accurately predict undesirable effects such as surface damage, microcracks, and residual stresses and develop strategies to mitigate them.
• Lastly, you will make a significant contribution to shortening development times, minimizing costly physical experiments, and systematically increasing efficiency in the wafer grinding process.