Company
Bosch Group
Location
Schwieberdingen, Germany
Employment type
Full-time
Seniority
Intern
Primary category
Electrical & Electronics Engineering
Posted date
6 Mar 2026
Valid through
5 May 2026
High-speed automotive interconnects increasingly operate at high frequency, where PCB materials and manufacturing variations strongly influence channel performance. Differences between PCB suppliers - such as laminate properties, copper foil roughness, and stackup implementations - can lead to significant variations in signal integrity metrics such as insertion loss, impedance, and propagation delay.
This internship focuses on the development of standardized high-speed PCB test coupons that enable objective comparison of materials and manufacturing processes across different suppliers. The goal is to design a universal measurement coupon containing multiple test structures that allow the characterization of key electrical parameters including insertion loss, dielectric loss, copper roughness effects, impedance, and glass-weave-induced skew.
The project contributes to establishing a repeatable measurement methodology for high-speed channel characterization, enabling supplier-independent evaluation and supporting robust high-speed PCB design.
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